METHOD
Chemcos-2111
-
180 ˚ Peel Adhesion
Parameters
화면을 좌, 우로 움직여 주세요.Materials Tape Size 25 × 300 mm Substrate SUS 304(50 × 125 × 2 mm) Standing Temperature 23 ± 1 ℃ Reinforcement 25 ㎛ PET Assembly Procedure
- RolledPressure Weight 2 kg Rolling Speed 300 mm/min Rolled 1-times Test Condition Dwell Time 30 min at RT Temperature 23 ± 1 ℃ Relative Humidity 50 ± 5% Peeling Angle 180˚ Peel Speed 300 mm/min
Chemcos-2112
-
90 ˚ Peel Adhesion
Parameters
화면을 좌, 우로 움직여 주세요.Materials Tape Size 25 × 300 mm Substrate SUS 304(50 × 125 × 2 mm) Standing Temperature 23 ± 1 ℃ Reinforcement 25 ㎛ PET Assembly Procedure
- RolledPressure Weight 2 kg Rolling Speed 300 mm/min Rolled 1-times Test Condition Dwell Time 30 min at RT Temperature 23 ± 1 ℃ Relative Humidity 50 ± 5% Peeling Angle 90˚ Peel Speed 300 mm/min
Chemcos-2121
-
180 ˚ Peel Adhesion in Chamber
Parameters
화면을 좌, 우로 움직여 주세요.Materials Tape Size 25 × 300 mm Substrate SUS 304(50 × 125 × 2 mm) Standing Temperature 23 ± 1 ℃ Reinforcement 25 ㎛ PET Assembly Procedure
- RolledPressure Weight 2 kg Rolling Speed 300 mm/min Rolled 1-times Test Condition Dwell Time 30 min at RT
→ 30 min in ChamberTemperature -20 ~ 100 ℃ Peeling Angle 180˚ Peel Speed 300 mm/min
Chemcos-2171
-
180˚ Peel Adhesion after leaving the Chamber
Parameters
화면을 좌, 우로 움직여 주세요.Materials Tape Size 25 × 300 mm Substrate SUS 304(50 × 125 × 2 mm) Standing Temperature 23 ± 1 ℃ Reinforcement 25 ㎛ PET Assembly Procedure
- RolledPressure Weight 2 kg Rolling Speed 300 mm/min Rolled 1-times Test Condition Dwell Time 30 min at RT
→ In chamber(Test time)
→ at least 30 min at RTTemperature -40 ~ 150 ℃ Peeling Angle 180˚ Peel Speed 300 mm/min
Chemcos-2142
-
180˚ Peel Adhesion after leaving a ThermoHygrostat
Parameters
화면을 좌, 우로 움직여 주세요.Materials Tape Size 25 × 300 mm Substrate SUS 304(50 × 125 × 2 mm) Standing Temperature 23 ± 1 ℃ Reinforcement 25 ㎛ PET Assembly Procedure
- RolledPressure Weight 2 kg Rolling Speed 300 mm/min Rolled 1-times Test Condition Dwell Time 30 min at RT
→ In chamber(Test time)
→ at least 30 min at RTTemperature 85 ℃ Relative humidity 185 % Peeling angle 180˚ Peel speed 300 mm/min
Chemcos-2152
-
180˚ Peel Adhesion after leaving a Thermar shock
Parameters
화면을 좌, 우로 움직여 주세요.Materials Tape Size 25 × 300 mm Substrate SUS 304(50 × 125 × 2 mm) Standing Temperature 23 ± 1 ℃ Reinforcement 25 ㎛ PET Assembly Procedure
- RolledPressure Weight 2 kg Rolling Speed 300 mm/min Rolled 1-times Test Condition Dwell Time 30 min at RT
→ In chamber(Test time)
→ at least 30 min at RTTemperature -40 ~ 85 ℃ Time 10 min ↑ Cycle 2 ↑ Peeling angle 180˚ Peel speed 300 mm/min
Chemcos-3121
-
Holding Power
Parameters
화면을 좌, 우로 움직여 주세요.Materials Tape Size 25 × 25 mm Substrate SUS 304(50 × 125 × 2 mm) Standing Temperature 23 ± 1 ℃ Reinforcement 25 ㎛ PET Assembly Procedure
- RolledPressure Weight 2 kg Rolling Speed 300 mm/min Rolled 1-times Test Condition Dwell Time 30 min at RT → In chamber Temperature 80 ℃ Test Time 1 hr ↑ Weight 1 kg Test angle 180˚
Chemcos-3111
-
Static Load
Parameters
화면을 좌, 우로 움직여 주세요.Materials Tape Size 20 × 100 mm Substrate SUS 304(50 × 125 × 2 mm) Standing Temperature 23 ± 1 ℃ Reinforcement 25 ㎛ PET Assembly Procedure
- RolledPressure Weight 2 kg Rolling Speed 300 mm/min Rolled 1-times Test Condition Dwell Time 30 min at RT → In chamber Temperature RT Test Time 1 hr ↑ Weight 100 g Test angle 90˚
Chemcos-4111
-
Ball Tack
Parameters
화면을 좌, 우로 움직여 주세요.Materials Tape Size 300 × 100 mm Ball Tack Tester Adjustable Angle Test Condition Test Angle 10°~30° Temperature 23 ± 1 ℃ Ball No. 32/32 inch ~ 1/32 inch Ball Retention Time 5 sec ↑
Chemcos-4231
-
Horizontal Resistance
Parameters
화면을 좌, 우로 움직여 주세요.Materials Tape Size 1 × 2 inch(TD) Test Equipment Model HIOKI RM3544 Jig Gold plated weight 2 ea(each 1 inch) Test Condition Temperature RT Time 30 sec Distance Between Jigs 1 inch
Chemcos-4241
-
Vertical Resistance
Parameters
화면을 좌, 우로 움직여 주세요.Materials Tape Size 1 × 1 inch ↑ Test Equipment Model HIOKI RM3544 Jig Gold plated weight Test Condition Temperature RT Time 30 sec Test Area 1 × 1 inch
Chemcos-4351
-
Charge Measurement
Parameters
화면을 좌, 우로 움직여 주세요.Materials Tape Size 300 × 210 mm Test Equipment Model TREK 152-1 Test Condition Temperature RT Test Time 10 sec Voltage 100 V
Chemcos-4352
-
Charge Measurement
Parameters
화면을 좌, 우로 움직여 주세요.Materials Tape Size 300 × 210 mm Test Equipment Model SIMCO ST-4 Test Condition Temperature RT Test Time 10 sec Voltage 100 V
Chemcos-4501
-
Insulation Resistance
Parameters
화면을 좌, 우로 움직여 주세요.Materials Tape Size 25 × 25 mm Substrate SUS 304(50 × 125 × 2 mm) Test Equipment Model HIOKI 2017 Assembly Procedure
- RolledPressure Weight 2 kg Rolling Speed 300 mm/min Rolled 1-times Test Condition Dwell time 30 min at RT Temperature RT Test Time 10 sec Voltage 100 V
Chemcos-2141
-
Residuum Test after leaving a ThermoHygrostat
Parameters
화면을 좌, 우로 움직여 주세요.Materials Tape Size 25 × 300 mm Substrate SUS 304(50 × 125 × 2 mm) or PCB Standing Temperature 23 ± 1 ℃ Reinforcement 25 ㎛ PET Assembly Procedure
- RolledPressure Weight 2 kg Rolling Speed 300 mm/min Rolled 1-times Test Condition Dwell time 30 min at RT
→ In chamber(Test time)
→ at least 60 min at RTTemperature
Relative humidity60 ℃ / 90 %
85 ℃ / 85 %Peeling angle 180˚ Peel speed 300 mm/min
Chemcos-2151
-
Residuum Test after leaving a Thermarl shock
Parameters
화면을 좌, 우로 움직여 주세요.Materials Tape Size 25 × 300 mm Substrate SUS 304(50 × 125 × 2 mm) or PCB Standing Temperature 23 ± 1 ℃ Reinforcement 25 ㎛ PET Assembly Procedure
- RolledPressure Weight 2 kg Rolling Speed 300 mm/min Rolled 1-times Test Condition Dwell time 30 min at RT
→ In chamber(Test time)
→ at least 60 min at RTTemperature -40 ~ 85 ℃ Time 10 min ↑ Cycle 2 ↑ Peeling angle 180˚ Peel speed 300 mm/min
Chemcos-2161
-
Residuum Test after leaving a Heating Press k
Parameters
화면을 좌, 우로 움직여 주세요.Materials Tape Size 25 × 300 mm Substrate SUS 304(50 × 125 × 2 mm) or PCB Standing Temperature 23 ± 1 ℃ Reinforcement 25 ㎛ PET Assembly Procedure
- RolledPressure Weight 2 kg Rolling Speed 300 mm/min Rolled 1-times Test Condition Dwell time 30 min at RT
→ In Plate(Test time)
→ ImmediatelyTemperature RT ~ 200 ℃ Pressure ~30 MPa Peeling angle 180˚ Peel speed 300 mm/min
